单项选择题X 纠错
A.Before the first solution design meeting with the customer
B.After the solution design proposal is submitted to manufacturing for review
C.Once the customer has supplied the solution design specifications to the sales team
D.After the solution design is completed and before the proposal is submitted to the customer
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单项选择题
A.Identify, assess, and mitigate technical risks.
B.Verify pricing and gather components for special bid submission.
C.Verify the proposed solution will fit within the customer's budget.
D.Review competitive offerings, system performance and delivery schedules.
单项选择题
A.IBM eConfig
B.IBM Performance Monitor
C.IBM Workload Estimator (WLE)
D.IBM System Planning Tool (SPT)
单项选择题
A.PowerHA SystemMirror Basic Edition
B.PowerHA SystemMirror Express Edition
C.PowerHA SystemMirror Standard Edition
D.PowerHA SystemMirror Enterprise Edition
单项选择题
A.DS6800
B.DS8100
C.DS8300
D.XIV Storage System
单项选择题
A.JS21
B.JS23
C.PS700
D.PS701
单项选择题
A.Implement PowerHA SystemMirror on both VIO servers.
B.Configure Etherchannel between the client LPARs and the two VIO servers
C.Configure Network Interface Backup between the two VIO servers and use each VIO server to access the network.
D.Implement Shared Ethernet Adapter failover and have all client partitions access the network through the shared adapters.
单项选择题
A.All the machines can be connected to the existing HMC, as long as it is updated to code level 7.7.1 or later
B.The Power 770 requires an HMC (7042-CR5 or later), so they must buy one. All of the systems can be managed by this new HMC
C.They should buy a new HMC for the Power 770 system, and leave the POWER5 and POWER6 based systems connected to the existing one
D.The Power 770 requires an HMC, so they should connect the Power 770 to the HMC and convert the POWER5 and POWER6 based servers to IVM
单项选择题
A.PowerVM
B.VMControl
C.Active Memory Sharing
D.Active Memory Expansion
单项选择题
A.Redundant system clock
B.Redundant service processor
C.POWER7 cores include redundant L3 caches
D.Main memory DIMMs contain an extra DRAM chip for improved redundancy
单项选择题
A.L3 only
B.L1 and L2
C.L2 and L3
D.L1,L2 and L3